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        Semiconductor manufacturing (wafer inspection, BGA and IC inspection, wire bonding, die bonding and sorting, laser marking, dicing, flip chip etc.)
         
        Hard disk (HGA, slider manufacturing, inspection, texturing of disk media etc.)
         
        Biomedical (DNA /Gene extraction, micro array, pharmaceutical manufacturing etc.) Machine tools (CNC milling, EDM wire cut etc.)
         
        Inspection systems (photon emission microscopes, vision systems etc.)
         
        LCD/TFT (inspection systems, laser marking, cutting etc.)
         
        Others (printing, automotive parts manufacturing, connectors manufacturing, dispensing systems, PCB manufacturing etc.)